Thermal Interface Materials Market Size, Growth, Key Players, Overview and Forecast 2022-2027

According to the latest report of the IMARC group, entitled “Thermal Interface Materials Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027”, the global thermal interface materials market reached a value of US$2.87 billion in 2021. Looking ahead, IMARC Group expects the market to reach US$5.03 billion. by 2027 growing at a CAGR of 9.7% in 2022-2027.

Thermal interface materials (TIM) represent many products that are used to facilitate heat dissipation and transfer in electronic devices. They function as an insert material between two mechanically mated surfaces, including the heat-generating chip and the dissipating device. Some widely used TIMs include gap-filling pads, graphite films, adhesives and greases, phase change materials, thermally conductive fabrics and rubber, etc. They help reach room temperature for electronic devices to ensure optimal operation. Apart from this, TIMs find various applications in semiconductor packaging, communication and consumer devices, power electronics, etc.

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Thermal Interface Materials Market Trends:

Rising levels of industrialization and rising demand for consumer electronics across the globe are some of the major factors driving the thermal interface materials market. In addition, the increasing use of TIMs to manufacture compact, portable, energy-efficient and durable light-emitting diode (LED) lamps acts as another important growth driver. Moreover, continuous technological advancements, along with growing demand for miniaturized devices and increasing use of multi-functional TIMs, are expected to bolster the global TMI market in the coming years.

Competitive Analysis and Segmentation of the Thermal Interface Materials Market 2022-2027:

Competitive landscape with key players:

The competitive landscape of the thermal interface materials market has also been examined along with the profiles of key players.

Some of these key players include:

  • 3M Company

  • Dow Inc.

  • Henkel AG & Co. KGaA

  • Honeywell International Inc.

  • Indium Society

  • Kitagawa Industries America Inc.

  • Laird Technologies Inc.

  • Momentive Performance Materials Inc.

  • Parker-Hannifin Corporation

  • Zalman Tech Co.Ltd.

Key Market Segmentation:

The report has segmented thermal interface materials on the basis of product type, application, and region.

Breakdown by product type:

  • Tapes and Films

  • Elastomeric bushings

  • Greases and Adhesives

  • Phase change materials

  • Metal based materials

  • Others

Breakdown by application:

  • Telecom

  • computer

  • Medical equipement

  • Industrial machinery

  • Durable consumer goods

  • Automotive electronics

  • Others

Breakdown by region:

  • North America (USA, Canada)

  • Europe (Germany, France, United Kingdom, Italy, Spain, Others)

  • Asia-Pacific (China, Japan, India, Australia, Indonesia, Korea, Others)

  • Latin America (Brazil, Mexico, Others)

  • Middle East and Africa (United Arab Emirates, Saudi Arabia, Qatar, Iraq, South Africa Others)

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Main highlights of the report:

  • Market Performance (2016-2021)

  • Market Outlook (2022-2027)

  • Market trends

  • Market drivers and success factors

  • Impact of COVID-19

  • Value chain analysis

  • Complete mapping of the competitive landscape

If you need specific information that is not currently covered in the report, we will provide it to you as part of the customization.

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