Open Compute Project Foundation (OCP) announces proven SoC disaggregation interface specification.

Chiplet interconnect specification optimized for maximum applicability enabling low cost
and energy efficient implementations.

AUSTIN, TX, July 19, 2022 /PRNewswire/ — Today, OCP Foundation, the non-profit organization that brings large-scale innovation to everyone, announced the release of the Bunch of Wires (BoW) specification for the Chiplet interconnect. The BoW specification represents a next step in OCP Open Domain Specific Architecture (ODSA) Project walks towards establishing an open chip ecosystem as a catalyst for a new silicon market and integrated circuit supply chain model. BoW specifies a Physical Layer (PHY) optimized for System-on-Chip (SoC) disaggregation and complete OCP ODSA PHY Open High Bandwidth Interconnect (OpenHBI) specification targeting high-bandwidth memory and other parallel bandwidth-intensive use cases.

“The demand for specialty silicon has steadily increased due to workload diversity, such as with the adoption of AI and ML, and we expect this trend to continue for several years. In response to this demand, OCP recognizes that it must be a catalyst in establishing open, standardized chiplet ecosystems and new markets by investing in chiplet interconnect technology that will enable composable silicon. BoW is an important step in this direction. We plan to intensify our efforts on the development of supply chain models for composable silicon,” said Bill CarterCTO, OCP Foundation.

The ODSA BoW PHY specification is optimized for basic (organic laminate) and advanced packaging technologies, enabling cost-effective and energy-saving designs, as well as high-performance designs across a wide range of process nodes. The specification was written to allow for many use cases resulting in significant economies of scale. Care was taken to impose as few constraints as possible and to avoid including in the specification required features that could increase design complexity when disaggregating an existing SoC.

The BoW specification, with an open license making it available to everyone, is already used by at least 10 companies, including Samsung and NXP, in more than a dozen different use cases spanning 5, 6, 12, 16, 22, and 65nm, and covering Chiplet-based products for networking, specialty AI silicon, FPGAs, and processors.

“The semiconductor industry continues to innovate in new and exciting directions with multi-core application-specific SoCs, custom core architectures, deep learning, optical communications, analog processing techniques, interfaces RF, memory architectures and more.The new challenge is how to integrate all of these disparate innovations, many of which are impractical to produce on edge process nodes.Today’s announcement of the OCP ODSA, the publication of the open source Bunch of Wires Specification for Chiplet Interconnect, provides a new tool to develop innovation in the market and opens the door to a more competitive landscape and diversity in innovation at varying rhythms and is the fuel or a healthy industry,” said Tom HackenbergSenior Analyst, Computing & Software Semiconductor, Memory and Computing Division, Yole Intelligence.

About the Open Compute Project Foundation
At the heart of the Open Compute Project (OCP) is its community of hyperscale data center operators, joined by telecom and colocation providers and enterprise IT users, working with vendors to develop open innovations which, when integrated into the product, are deployed from the cloud to the edge. The OCP Foundation is responsible for fostering and serving the OCP community to meet the market and shape the future, bringing hyperscale innovations within everyone’s reach. Responding to the market is accomplished through open designs and best practices, and with data center facilities and IT equipment incorporating innovations developed by the OCP community for efficiency, large-scale operations, and sustainability. Shaping the future involves investing in strategic initiatives that prepare the computing ecosystem for major changes, such as AI and ML, optics, advanced cooling techniques, and composable silicon. Learn more about www.opencompute.org.

Media Contact
Dirk VanSlyke
Open Computing Project Foundation
Vice President, Marketing Director
[email protected]
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Foundation of the Open SOURCE Computing Project