Henkel expands its line of Micro-Thermal Interface Material (mTIM) coatings to meet the demands of higher bandwidth optical transceivers

Durable coating compatible with nickel-plated heatsinks and transceivers

Irvine, California / United States – WEBWIRE


As a materials specialist for data and telecommunications applications, Henkel continues to meet evolving performance demands for high data bandwidth applications. Today the company announced a new formulation in its Bergquist microTIM mTIM 1000 micro-thermal interface coating portfolio. thermal challenges of 400, 600, and 800 GB pluggable optical modules (POMs).


High-capacity POMs can produce up to 30 watts of power while running, generating heat that diminishes performance. Current approaches to thermal control involve conventional metal-to-metal interfaces (transmitter-receiver to heat sink) and the use of adhesive-applied phase-change materials. Henkel’s coating materials offer a more robust solution with the company’s newest formulation, Bergquist microTIM mTIM 1028, designed to provide durable thermal control for high bandwidth density POMs. These devices are typically constructed with nickel housings and interfaced with nickel clad copper heat sinks for heat removal from the system. Compared to other solutions, Bergquist’s mTIM 1028 microTIM can withstand up to 500 pulls and insertions without performance degradation and reduces POM operating temperatures by up to 0.18°C/W.


“With today’s expectations for data throughput, controlling heat is one of the most effective ways to improve operational efficiency,” said Wayne Eng, global head of data and communications market strategy. telecommunications at Henkel. “Our revolutionary microTIM has been proven with standard aluminum-based heatsinks and is now being extended to nickel-clad copper heatsinks often used with higher bandwidth modules. Additionally, the material can also be coated on the transceiver, providing a value-added solution to POM manufacturers as a point of competitive differentiation.


Internal testing of the Bergquist microTIM mTIM 1028 with a 400 GB QSFP-DD module revealed the following:

  • Produced an average performance increase of 0.18°C/W over a metal-to-metal interface over various pressure ranges.
  • A peak temperature of 300°C for a duration of 30 minutes had no adverse effect on the performance of the coating.
  • Compatible with complex heat pipe and finned heat sink designs.
  • Can also be applicable as a heat dissipation solution for any metal-to-metal interface, including liquid cooling components.

“Our approach to heat control in hyperscale data center line cards is an essential development for future performance goals,” says Eng. “While conventional thermal management methods are adequate for 100Gb POMs, the bandwidth and reliability requirements of next-generation links are enormous. We believe this new hardware innovation is an important part of thermal control and line card performance optimization, and could potentially play a role in reducing heat in other data center applications, such as as liquid cooling pipes and plates.


Henkel’s nickel-compatible Bergquist microTIM mTIM 1028 is the latest material in the company’s microTIM line and is available for sampling upon request. For more information on Henkel data center solutions, visit this resource.

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